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ESP32 Enclosure Design

A custom 3D-printed enclosure for the ESP32 sensor node. Designed in TinkerCAD with ventilation holes, cable management slots, snap-fit lid, and wall-mount option.

TinkerCAD 3D Printing PLA Filament ESP32 Fit Snap-fit Lid
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PLA · TinkerCAD · FDM
Design & Print Photos
3D model renders and printed results
3D Model Front
3D Model Front
3D Model Back
3D Model Back
Lid Design
Lid Design
Printed Body
Printed Body
Assembled Box
Assembled Box
Mounted on Wall
Mounted on Wall
Design Features
What makes this enclosure practical
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Snap-fit Lid
Tool-free lid that snaps on and off securely. No screws needed for quick access to the board.
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Ventilation Holes
Slots on the sides and bottom allow airflow to keep the ESP32 cool during operation.
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Cable Management
Dedicated cutouts for USB power cable and sensor wire routing. Keeps cables tidy and strain-free.
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Wall Mount Option
Built-in keyhole slots on the back for easy wall or surface mounting without extra brackets.
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Exact Board Fit
Designed around ESP32 DevKit v1 dimensions with 0.3mm tolerance for a snug, rattle-free fit.
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FDM Print-friendly
No support structures needed. Flat base, gentle overhangs, all printable on standard FDM printers.
Print Specifications
Settings used for printing
SettingValue
Material PLA
Layer Height 0.2 mm
Infill 20%
Wall Thickness 1.2 mm (3 perimeters)
Print Speed 50 mm/s
Bed Temperature 60 °C
Nozzle Temp 210 °C
Supports None required
Print Time ~2.5 hours
DimensionValue
Outer Width 72 mm
Outer Depth 42 mm
Outer Height 28 mm (body) + 6 mm (lid)
Wall Thickness 2 mm
Board Clearance 1 mm all sides
USB Cutout 12 × 8 mm
Sensor Hole 5 mm diameter
Vent Slots 2 × 15 mm × 3 mm
Mount Holes 4 mm keyhole × 2
Tools Used
Software and hardware for design and printing
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TinkerCAD
3D CAD modelling and parametric design
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FDM 3D Printer
Standard FDM printer with 0.4 mm nozzle
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PrusaSlicer
Slicing software for generating G-code
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Digital Calipers
Precise measurement of ESP32 board